AI 3D post-reflow AOI
Aton
Tall components.
One powerful system.
AI 3D post-reflow AOI, with multi-level inspection up to 80 mm for tall components and heavy assemblies.
Aton
Overview Specifications What it inspects Technology Programming
Post-reflow
3D AOI for SMT and THT
550 x 500 mm
board envelope, up to 10 kg
0.8 s
per FoV, 50 x 50 mm
140 mm
bottom clearance
Multi-level inspection
Dynamic focus across an 80 mm range, with 120 mm top clearance and 140 mm bottom clearance: boards with components at very different heights are inspected in one pass.
Built for the boards that break other systems
Large, heavy, densely populated or carrying tall connectors — power electronics, automotive and industrial control. Warp compensation of ±5 mm keeps the inspection on target.
The same intelligence, the same software
Aton runs Neith and the same neural networks as Horus: one programming environment and one training programme across the line.
Specifications at a glance
| Aton | |
|---|---|
| Inspection | Post-reflow AOI |
| Optics | 25 MP top camera, 4 RGB projectors, custom telecentric lens |
| Field of view | 50 x 50 mm in 0.8 s/FoV |
| Height resolution | 2 µm |
| Height measurement range | Up to 80 mm |
| Max. board (X, Y)* | 550 x 500 mm |
| Thickness | Up to 8 mm |
| Max. weight | 10 kg |
| Clearance top / bottom | 120 / 140 mm · 3 mm edge |
| Machine dimensions (W, D, H) | 1,140 x 1,630 x 1,786 mm |
*X=Length, Y=Width.
What it inspects
Inspect virtually every component
From low-profile components to tall connectors, read by neural networks on high-resolution 2D and true-3D data together.
AOI
Body and placement
Component location, size and position, tilt and lift, with IPC-oriented acceptance criteria.
Neith readout Locations
Leads, solder and marking
Pin and lead presence and position, solder joint condition, bridges, planarity, solder balls and detection of display scratches, with IPC-oriented acceptance criteria.
Neith readout Pin solder joint 3D / Tall white connector 3D
Difficult geometries
Reflective surfaces and metallic pins. High-density fine-pitch. Deep shadows and tall connectors. Macro and non-standard applications.
Marking and orientation
Polarity, OCR and OCV, including rotated text and supplier variants, plus resistor colour-band identification.
Neith readout OCR / Polarity
Beyond the standard inspectors
Macro builds custom tests for geometries no standard inspector covers: heights, distances, coplanarity. Anomaly detection flags deviations nobody wrote a rule for, at component level and across the whole board.
Neith readout Anomaly detector
joint 3D
connector 3D
detector
See what others miss.
Underfill
UV-reactive underfill inspected with UV illumination, enabling 3D reconstruction to verify glue presence, distribution and applied amount.
Encapsulation
Encapsulant volume, height and coverage inspected in true 3D, so a component is confirmed protected, not just present.
LED
Position, coplanarity and die alignment inspection, even on reflective packages, with reliable identification of the LED’s true colour without interference from die fluorescence.
Send us a difficult assembly.
We run it and send back what the platform has found.
The technology inside
The technology that makes it possible
True 3D. Patented optical head.
A 25 MP telecentric top camera, four RGB projectors and multi-level RGBW lighting, with optional polarised and side cameras. Built for reflective metals, shadowed zones, tall connectors and fine pitch.
AI in the Inspection Cycle
It decides during the inspection cycle, not after it. Proprietary neural networks recognise and classify board features in real time, with FPGA processing keeping pace with the line.
Neith Software Platform
One browser-based software environment for programming, data and workflows, across every inspection stage and every Delvitech platform.
Programming and learning
AI Programming and Learning
Training Manager
Your team can train the neural networks directly on the platform, using your own boards and production images. The machine learns to recognise components beyond its initial training while preserving existing knowledge, allowing your team to adapt inspection independently and keep know-how in-house.
Self-programming
Accelerates component recognition and recipe creation, reducing the engineering effort required to bring a new product to stable inspection.
Coming Soon
Predictivity
Proactive process control through neural pattern prediction, recognising what precedes a defect before one occurs.
Coming Soon
Automated Validation Station
The system autonomously analyses components and defects, validates recurring calls and uses AI to optimise inspection parameters, verifying each change against a pass/fail reference set.
Where it fits.
Built for tall and multi-level assemblies across automotive and EV, Electronics Manufacturing Services (EMS), industrial and power electronics, aerospace and defence, medical devices, telecommunications, AI computing and data centres and consumer electronics.
Brochure
Download the Aton brochure
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FAQ
What board size and weight can Aton handle?
Aton supports boards up to 550 x 500 mm and a maximum board weight of 10 kg.
How tall can the components inspected by Aton be?
Aton measures component heights up to 80 mm. Its dynamic focus inspects boards with components at different heights in one pass.
What component features and defects can Aton inspect?
Aton can inspect component location, size and position, tilt and lift, as well as pin and lead presence and position, solder joint condition, bridges, planarity and solder balls.
Does Aton use the same software as Horus?
Yes. Aton runs Neith and the same neural networks as Horus, providing one programming environment and one training programme across the line.
