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Delvitech at electronica 2026: the full HORUS family, live in Munich

Delvitech at electronica 2026: the full HORUS family, live in Munich

From 10 to 13 November 2026, we will be at electronica 2026 in Munich, at Hall A4, Booth 359 of the Trade Fair Center Messe München, with the full Delvitech HORUS family running live: HORUS, HORUS DUAL LANE and HORUS MAX.

Our team will demonstrate the shared AI-native inspection architecture and present the new software release, featuring Self-Programming and improved inspection algorithms.


electronica 2026 at a glance
  • Where: Trade Fair Center Messe München, Am Messesee 2, 81829 Munich, Germany
  • When: 10-13 November 2026.
  • Our booth: Hall A4, Booth 359
  • On show: HORUS, HORUS DUAL LANE and HORUS MAX, running live

Why are power electronics boards harder to inspect?

Large copper areas can reflect light, while substantial solder joints and tall components can create shadowed areas. Mixed SMT and THT assemblies and larger boards add further complexity. These conditions can lead to false calls and additional manual verification, increasing the time operators spend reviewing inspection results

Which HORUS platform fits your boards?

All three platforms share the same AI-native inspection architecture and Neith software environment. The configurations address different board formats, weights and throughput requirements.

PlatformBest forBoard handling
HORUSAll-purpose, versatile inline inspectionUp to 560 × 550 mm, 0.5-5 mm thick, 5 kg
HORUS DUAL LANEHigher line throughput: two lanes in the same footprint560 × 268 + 268 mm in dual lane, 560 × 550 mm in single lane; 0.5-5 mm thick, 5 kg
HORUS MAXLarger, longer and heavier boardsUp to 815 × 715 mm, 0.5-10 mm thick, 15 kg

One Inspection Intelligence across the Horus family.

Our proprietary neural networks are embedded in the inspection architecture from the outset. They recognise and classify components from programming through to live inspection, helping maintain consistent recognition across component and supplier variations. This helps reduce false calls and manual checks as production evolves.

Our patented optical system combines 25 MP imaging with telecentric optics. It reconstructs true 3D geometry and measures dimensions, height and planarity with 2 µm height resolution.

FPGA processing handles the inspection data acquired by the optical system in real time, at more than 40 Gbit/s.

Our optics, processing hardware, proprietary AI and Neith software are engineered as one configurable platform for SPI, AOI and customised electronic and electromechanical inspection.

A common environment simplifies programming, training and maintenance. The platform’s modular architecture is built to evolve with your products and inspection needs.

Neith 3.0 for programming and inspection

We will also present Neith 3.0, the new release of our web-based platform for inspection programming, data management and machine control. It features Self-Programming and general improvements to the inspection algorithms.

Self-Programming accelerates recipe creation and reduces the effort needed to set up inspection for new products.

Within the same Neith environment, Training Manager lets your team teach HORUS to recognise new components directly on the machine using your own production images. Recognition extends beyond the initial training while existing knowledge is preserved. Your team can adapt inspection independently and keep know-how in-house for reuse across products, lines and sites.

What will you see at our booth?

Our team will run HORUS, HORUS Dual Lane and HORUS MAX side by side in Hall A4, Booth 359. We will demonstrate our true 3D and neural inspection approach and present the programming and learning tools in Neith.

Talk to us about your board formats, throughput requirements and programming workflows to discuss how the HORUS configurations can support your production.

See you in Munich, at Hall A4, Booth 359.